Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
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United States of America Patent
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Dec 2, 2008
Grant Date -
Sep 11, 2008
app pub date -
Mar 5, 2007
filing date -
Mar 5, 2007
priority date (Note) -
Expired
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Abstract
Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.
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