Laser Machining Apparatus

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United States of America Patent

SERIAL NO

12033932

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey.

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Patent Owner(s)

Patent OwnerAddress
HITACHI VIA MECHANICS LTDKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyama, Hiroshi Ebina-shi, JP 71 540
Maruyama, Shigenobu Yokohama-shi, JP 27 405
Ohmae, Goichi Ebina-shi, JP 7 14
Shiga, Masayuki Ebina-shi, JP 7 120

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