TAB WRAP FOLDABLE ELECTRONIC ASSEMBLY MODULE AND METHOD OF MANUFACTURE
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United States of America Patent
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Issued Date -
Sep 18, 2008
app pub date -
Jan 11, 2006
filing date -
Jan 11, 2006
priority date (Note) -
Abandoned
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Abstract
A high-density memory module is made up of two memory boards, each with memory elements affixed to each of two sides, the two memory boards disposed on either side of a central rigid substrate, each memory board having a flexible wiring array, electrically and mechanically affixed at one end to one of the memory board and at the other end to the other of the memory boards, the flexible wiring array wrapped at its midpoint around a bottom of the central rigid substrate, so that two linear arrays of comb tabs affixed to the flexible wiring array are disposed in proximity to the bottom of the central rigid substrate, so that the central rigid substrate may be inserted into a mating electrical connector, making an electrical connection with both memory boards.
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