Importance

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Abstract

A method of manufacturing a device includes the steps of forming dividing grooves with a predetermined depth along planned dividing lines of a wafer, then grinding the backside surface of the wafer to expose the dividing grooves on the back side and to divide the wafer into individual devices, mounting a UV-curing adhesive film to the backside surface of the wafer divided into the individual devices, adhering the adhesive film side of the wafer to a dicing tape attached to an annular frame, radiating UV rays from the face side of the wafer to cure the regions of the adhesive film which correspond to the dividing grooves, expanding the dicing tape to exert tensile forces on the adhesive film, so as to split the adhesive film into the individual devices, with the cured regions of the adhesive film as starting points of splitting, and releasing the device from the dicing tape and thereby picking up the device.

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First Claim