Stacked electronic component package having single-sided film spacer
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United States of America Patent
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Issued Date -
Oct 2, 2008
app pub date -
Feb 17, 2006
filing date -
Feb 17, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of fabricating a stacked electronic component package includes placing a single-sided film spacer on an upper surface of a lower electronic component inward of bond pad with a pickup tool. After being adhered to the upper surface of the lower electronic component, the pickup tool is retracted from the single-sided film spacer. An upper surface of a film, e.g., an organic film, of the single-sided film spacer is nonadhesive. Accordingly, the single-sided film spacer does not stick to the pickup tool during retraction of the pickup tool from the single-sided film spacer.
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