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Abstract

A method and system for depositing a thin film on a substrate using a vapor deposition process is described. The processing system comprises a process chamber having a pumping system configured to evacuate the process chamber, a substrate holder coupled to the process chamber and configured to support the substrate, and a gas distribution system coupled to the process chamber and configured to introduce a film forming composition to a process space in the vicinity of a surface of the substrate. Furthermore, a heat source is coupled to the gas distribution system, wherein the heat source comprises one or more heating elements coupled to a power source, and wherein the one or more heating elements are disposed on an interior surface of the gas distribution system or embedded within the gas distribution system or both, and configured to interact with the firm forming composition and cause pyrolysis of one or more constituents of the film forming composition when heated.

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First Claim