Molded Body, Method For Producing the Body and Use Thereof
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United States of America Patent
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Issued Date -
Oct 2, 2008
app pub date -
Jun 30, 2005
filing date -
Jul 21, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A molded body comprises a film with a film thickness D ranging from 1 .mu.m to 1000 .mu.m, with at least one hollow structure configured into the film. Each hollow structure has an outside diameter d equal to at least double value of film thickness D, a height h is equal to or less than double the value of the outside diameter d, a wall thickness b greater than 0.02 times the film thickness D and less than or equal to the film thickness D and a local curvature radius r greater than 0.2 times and less than or equal to 5 times the wall thickness b. The film and the hollow structure include a plurality of pores.
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