Halogen-free flame retardant epoxy resin composition, prepreg, and copper clad lamination
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 2, 2008
app pub date -
Aug 29, 2007
filing date -
Mar 28, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed is an epoxy resin composition featured by comprising a phosphate with phenolic or benzoxazine groups for enhancing flame retardancy. The phosphate used herein has higher molecular weight and higher viscosity than conventional ones. Because the phosphate is able to react with the epoxy resin at high temperatures, greater amounts of phosphate can be added to the epoxy resin to increase the viscosity of the epoxy resin prepreg for copper clad laminates or printed circuit plates.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully