Film-Forming Apparatus And Film-Forming Method
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United States of America Patent
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Issued Date -
Oct 2, 2008
app pub date -
Mar 29, 2005
filing date -
Mar 29, 2004
priority date (Note) -
Abandoned
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Abstract
For increasing the film-forming rate and enabling uniform film formation and waste elimination of raw material, a film-forming method and a film-forming apparatus can reach an evaporated film-forming material to a surface of a substrate by the flow of a transport gas so as to control the film-forming conditions by the flow of the gas. Thereby a uniform thin film can be deposited on the large-area substrate. That is, by directing the evaporated raw material toward the substrate, it is possible to increase the film-forming rate and achieve uniform film formation.
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