JOINTING METHOD FOR SUPPORT STRUCTURE OF FILED EMISSION DISPLAY ELEMENT

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United States of America Patent

APP PUB NO 20080242180A1
SERIAL NO

11693875

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A jointing method for the support structure of a FED component is provided for fixing the relative position between the support structure and the electrode plates; first of all, a bearing plate is provided, on which a plurality of grooves spaced in parallel are, in advance, arranged for placing support structures thereon; furthermore, there is a metal jointing layer arranged respectively on the substrates of cathode and anode for aligning and positioning the substrates with respect to the bearing plate having a plurality of support structures, then the plural support structures are pressed together with the metal jointing layer; finally, both the jointed substrates and the bearing plates are simultaneously sent into a vacuum furnace for processing a high temperature sinter procedure, whereby the support structures and the substrates are formed into an eutectic structure through the metal jointing layers; therefore, the relative position between the support structures and substrates is fixed.

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Patent Owner(s)

Patent OwnerAddress
TECO ELECTRIC & MACHINERY CO LTDNO 156-2 SONGJIANG RD JHONGSHAN DISTRICT TAIPEI CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Guo-Hua Taipei City, TW 7 11
Yang, Frank Taipei City, TW 457 17290

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