Method for cleaning elements in vacuum chamber and apparatus for processing substrates
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United States of America Patent
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Jun 26, 2012
Grant Date -
Oct 9, 2008
app pub date -
Jun 2, 2008
filing date -
Aug 25, 2003
priority date (Note) -
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Abstract
To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.
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