Polishing Method and Polishing Film Used in Such Polishing Method
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United States of America Patent
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Issued Date -
Oct 9, 2008
app pub date -
Dec 9, 2004
filing date -
Jan 23, 2004
priority date (Note) -
Abandoned
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Abstract
Disclosed is a polishing method which is effective to prevent lowering of the polishing efficiency in the later stage of polishing. The polishing method is characterized in that polishing is performed while so adjusting a polishing liquid as to have a pH of not less than 2 and less than 7.
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