Pressure sensor device including temperature sensor contained in common housing
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United States of America Patent
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Apr 6, 2010
Grant Date -
Oct 16, 2008
app pub date -
Feb 29, 2008
filing date -
Apr 13, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A pressure sensor device includes a temperature sensor mounted on a common housing composed of a resin head and a resin pipe both hermetically connected to each other. The pressure sensor device is mounted on, for example, on an intake manifold of an internal combustion engine to measure an amount of air supplied to the engine based on detected pressure and temperature of the air. A pressure sensor is mounted on the resin head, and a temperature sensor element is supported in the resin pipe. A lead wire of the temperature sensor element such as a thermistor is electrically connected to a conductor bar embedded in the resin pipe. The temperature sensor is directly exposed to the air in the intake manifold, and a size of the temperature sensor and the lead wire is made small to make a response speed of the temperature sensor element high.
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