Multilayer high-frequency circuit board
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United States of America Patent
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-
Apr 24, 2012
Grant Date -
Oct 16, 2008
app pub date -
Apr 9, 2008
filing date -
Apr 10, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer circuit is provided in the signal line layer and includes a ground connecting portion connected to the ground layers and a signal line connecting portion connected to the signal line. One of the signal line connecting portion and the ground connecting portion surrounds an outer periphery of the other of the signal line connecting portion and the ground connecting portion concentrically with the one being separated from the outer periphery of the other along the signal line layer. An inner periphery of the one and the outer periphery of the other have a similar shape excluding a complete circle.
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