STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
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United States of America Patent
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app pub date -
Apr 28, 2008
filing date -
Jan 24, 2006
priority date (Note) -
Abandoned
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Abstract
A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects with the lead frame directly on a bottom mold and clamped by a top mold, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects.
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