PANEL-TYPE HEAT SINK MODULE
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United States of America Patent
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Issued Date -
Oct 16, 2008
app pub date -
May 4, 2007
filing date -
Sep 22, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The panel-type heat sink module combines the heat-conducting panel, fin heat sink, diversion tank, fan and heat pipe into a single module. There is a heat-conducting surface and an assembly surface of the heat-conducting panel. The fin heat sink is assembled onto the assembly surface. The diversion tank is adapted onto the assembly surface and located nearby the fin heat sink. The diversion tank includes a fan container and a diversion channel. The fan is assembled into the fan container, and the heat pipe is assembled between the assembly surface and the fin heat sink. The heat pipe penetrates through the diversion tank; thus, the heat sources guided by the heat-conducting panel will be uniformly guided into the fin heat sink and diversion tank via the heat pipe. An air stream generated by the fan flows towards the fin heat sink, improving heat-radiation, and reducing assembly space.
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