3-dimensional multi-layered modular computer architecture

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United States of America Patent

PATENT NO 8274792
SERIAL NO

12066003

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Abstract

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A 3-Dimensional multi-layered modular computer (3DMC) is disclosed that comprises removable layers of at least one CPU layer, at least one volatile memory layer, and at least one Input/Output (I/O) interface layers. The layers are stacked in parallel and are electrically connected to create a computing apparatus. Each of the layers is formed from encapsulating material having one or more internal cavities for chip dice, passive components, active components, and conductor's traces. A plurality of Thermal Conducting Rods (TCRs) is capable of conducting and removing heat generated by the components in the layers from the 3DMC apparatus to an external medium. Each TCR perpendicularly passes through the layers.

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Patent Owner(s)

  • BEYOND BLADES;BEYOND BLADES LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Soffer, Aviv Moshav Ein Ayala, IL 53 955

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