Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device
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United States of America Patent
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app pub date -
Jul 12, 2005
filing date -
Jul 16, 2004
priority date (Note) -
Abandoned
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Abstract
An electronic circuit assembly (A1) comprises a casing (1) having two opposite outer faces (S1.sub.sup, S1.sub.inf) and an inner space (V1) separate from each outer faces by a respective closing portion (4, 5), and a single die (10) incorporating an integrated circuit. The casing (1) includes integrated electrically conducting elements (21) connecting terminals of the die (11) to pads of the casing (31.sub.sup). The electrically conducting elements also connect sets of pads respectively located on each one of the opposite outer face of the casing (31.sub.sup, 31.sub.inf). Such electronic circuit assemblies (A1-A4) are suitable for being stacked with bonding means (300, 303) arranged between respective sets of pads (31.sub.sup, 32.sub.int) of two successive electronic circuit assemblies in a stack.
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