PALLADIUM-CONTAINING PLATING SOLUTION AND ITS USES
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United States of America Patent
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Issued Date -
Oct 16, 2008
app pub date -
Dec 20, 2007
filing date -
Apr 13, 2007
priority date (Note) -
Abandoned
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Abstract
A palladium-containing electroplating solution and method for providing a palladium or palladium alloy membrane on a porous metal support are provided. The subject invention uses electroplating to manufacture a palladium or palladium alloy membrane on a porous metal with a decreased preparation time and simplified preparation procedure. Moreover, the palladium or palladium alloy membrane prepared by the subject invention exhibits excellent compactness and good resistance to the hydrogen embrittlement, as well as a high applicability.
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