Encapsulation method
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United States of America Patent
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Mar 29, 2011
Grant Date -
Oct 16, 2008
app pub date -
Apr 10, 2007
filing date -
Apr 10, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defined by the first and second molds. A vacuum is applied to the cavity and the vacuum is varied in response to the size of the cavity. The vacuum can be varied in response to a predetermined vacuum profile. For example, in certain embodiments the vacuum is varied in response to the position of the first mold relative to the second mold, wherein the vacuum is increased as the cavity height is reduced.
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