Chip Module and Method for Producing a Chip Module
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United States of America Patent
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Issued Date -
Oct 23, 2008
app pub date -
Aug 28, 2006
filing date -
Sep 15, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention pertains to a chip module for producing contactless chip cards with a chip carrier that is provided with inner and outer contacts on a substrate, wherein the inner contacts are bonded to terminal areas of a chip unit arranged on the chip carrier and the outer contacts serve for being bonded to an antenna, and wherein the chip unit is accommodated in a sandwich-like fashion between the substrate and a fiber-reinforced cover layer such that the cover layer is connected to the substrate adjacent to at least two opposite lateral edges of the chip unit, as well as to a method for producing a chip module.
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