Adhesive layer for resin and a method of producing a laminate including the adhesive layer
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United States of America Patent
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Issued Date -
Oct 23, 2008
app pub date -
Sep 27, 2007
filing date -
Sep 27, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An adhesive layer for resin according to the present invention is formed of copper or a copper alloy for adhering a resin to a layer of copper or a copper alloy. The adhesive layer is formed of a metal layer of a coralloid structure made of an aggregation of a number of particles of copper or a copper alloy with gaps between the particles, and a plurality of micropores are present on the surface. The micropores have an average diameter in a range of 10 nm to 200 nm, and at least two micropores in average are present per 1 .mu.m.sup.2 of the metal layer surface. Thereby, sufficient adhesion between the resin and the copper or copper alloy is provided. This serves to prevent ion migration caused by dendrites, which has been a problem in a conventional layer of tin or a tin alloy, and the adhesion to a resin having a high-glass transition temperature (Tg) is improved as well. The present invention also provides a method of producing a laminate including the adhesive layer.
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