Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components
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United States of America Patent
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app pub date -
Jan 21, 2005
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Jan 21, 2004
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Abstract
A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
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