Multi-layered stents and methods of implanting
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United States of America Patent
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Issued Date -
Oct 23, 2008
app pub date -
Feb 15, 2008
filing date -
Feb 15, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of percutaneously delivering a multi-layered stent assembly to a desired implantation location of a patient including the steps of radially compressing a multi-layered stent assembly to a compressed size for implantation in a patient, the multi-layered stent assembly including a first stent, a second stent coaxially positioned within at least a portion of a length of the first stent, and a valve, wherein the first stent comprises at least one different material property than the second stent. The method further includes delivering the multi-layered stent assembly to the desired implantation location of the patient using a delivery system and substantially simultaneously expanding the first stent and the second stent of the multi-layered stent assembly at the desired implantation location to a radially expanded size that is larger than the compressed size.
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