Semiconductor Polishing Composition
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United States of America Patent
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Issued Date -
Oct 30, 2008
app pub date -
Mar 28, 2005
filing date -
Mar 29, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor polishing composition is disclosed. The semiconductor polishing composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, an increase rate of average particle diameter of fumed silica after a shake test for 10 days is 10% or less.
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