Semiconductor memory device and manufacturing method thereof

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United States of America Patent

SERIAL NO

12213542

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After an ONO film in which a silicon nitride film (22) formed by a plasma nitriding method using a plasma processor having a radial line slot antenna is sandwiched by silicon oxide films (21), (23), a bit line diffusion layer (17) is formed in a memory cell array region (11) by an ion implantation as a resist pattern (16) taken as a mask, then lattice defects are given to the silicon nitride film (22) by a further ion implantation. Accordingly, a highly reliable semiconductor memory device can be realized, in which a high quality nitride film is formed in a low temperature condition, in addition, the nitride film can be used as a charge trap film having a charge capture function sufficiently adaptable for a miniaturization and a high integration which are recent demands.

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SPANSION LLCSUNNYVALE CA 94088-3453

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashi, Masahiko Aizuwakamatsu, JP 58 505
Kajita, Tatsuya Aizuwakamatsu, JP 26 389
Nakamura, Manabu Aizuwakamatsu, JP 88 1492
Nansei, Hiroyuki Aizuwakamatsu, JP 30 335
Sera, Kentaro Aizuwakamatsu, JP 12 288
Takagi, Hideo Aizuwakamatsu, JP 38 907
Utsuno, Yukihiro Aizuwakamatsu, JP 27 263

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