PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS
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United States of America Patent
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Issued Date -
Nov 6, 2008
app pub date -
May 2, 2007
filing date -
May 2, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
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