COPPER, COPPER ALLOY, AND MANUFACTURING METHOD THEREFOR
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United States of America Patent
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app pub date -
Jun 5, 2008
filing date -
Mar 27, 2001
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Abandoned
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Abstract
Copper and copper alloy comprises: a structure having fine crystal grains with grain size of 1 .mu.m or less after a final cold rolling with a reduction .eta., wherein .eta. is expressed in the following formula and satisfying .eta..gtoreq.3; and an elongation of 2% or more in a tensile test. .eta.=ln(T.sub.0/T.sub.1) T.sub.0: plate thickness before rolling, T.sub.1: plate thickness after rolling.
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