Electronic Assemblies without Solder and Methods for their Manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Nov 13, 2008
app pub date -
May 12, 2008
filing date -
May 8, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.
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