Curable Composition and Sealing Method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20080279617A1
SERIAL NO

11547542

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a curable composition comprising (a) a vinyl-based polymer containing, in its molecule, at least one alkenyl group which can be hydrosilylated, and having a number average molecular weight of 500 to 1,000,000, (b) a hydrosilyl group-containing compound and (c) a silicone powder, and a sealing method using the curable composition. According to the invention, there can be provided a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set.

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Patent Owner(s)

Patent OwnerAddress
THREE BOND CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosogi, Satoshi Tokyo, JP 1 0
Tanaka, Masayuki Tokyo, JP 361 4182

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