High-speed router with backplane using tuned-impedance thru-holes and vias

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United States of America Patent

SERIAL NO

12011298

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Abstract

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A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.

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Patent Owner(s)

Patent OwnerAddress
FORCE10 NETWORKS INC350 HOLGER WAY SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goergen, Joel R Maple Grove, MN 43 735

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