Light emitting device and manufacturing method of the same
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United States of America Patent
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Issued Date -
Nov 27, 2008
app pub date -
Apr 23, 2008
filing date -
Apr 23, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.
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