Semiconductor memory structures

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7888719
APP PUB NO 20080290467A1
SERIAL NO

11752736

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor structure includes a first conductive layer coupled to a transistor. A first dielectric layer is over the first conductive layer. A second conductive layer is within the first dielectric layer, contacting a portion of a top surface of the first conductive layer. The second conductive layer includes a cap portion extending above a top surface of the first dielectric layer. A first dielectric spacer is between the first dielectric layer and the second conductive layer. A phase change material layer is above a top surface of the second conductive layer. A third conductive layer is over the phase change material layer. A second dielectric layer is over the first dielectric layer. A second dielectric spacer is on a sidewall of the cap portion, wherein a thermal conductivity of the second dielectric spacer is less than that of the first dielectric layer or that of the second dielectric layer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jong, Chao-An Hsinchu, TW 9 164
Shue, Shau-Lin Hsinchu, TW 407 6064

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