HEAT DISSIPATION SUBSTRATE AND HEAT DISSIPATION MATERIAL THEREOF
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United States of America Patent
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Issued Date -
Nov 27, 2008
app pub date -
Mar 21, 2008
filing date -
May 23, 2007
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Abandoned
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Abstract
A heat dissipation material comprises (1) fluorine-containing crystalline polymer having a melting point higher than 150.degree. C., with a weight percentage of around 15-40%; (2) heat conductive fillers dispersed in the fluorine-containing crystalline polymer with a weight percentage of around 60-85%; and (3) coupling agent of 0.5-3% of the heat conductive fillers by weight and having a chemical formula of: where R1, R2 and R3 are alkyl group C.sub.aH.sub.2a+1, a.gtoreq.1; X and Y are selected from hydrogen, fluorine, chorine, and alkyl group; and n is a positive integer.
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