Stage yield prediction
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United States of America Patent
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Jun 14, 2011
Grant Date -
Nov 27, 2008
app pub date -
May 22, 2008
filing date -
May 24, 2007
priority date (Note) -
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Abstract
In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a new wafer design, yield is predicted separately for the systematic defects and the random defects. A combined yield is then calculated based on the yield predicted for the systematic defects and the yield predicted for the random defects.
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