Multilayer wiring board for an electronic device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jan 11, 2008
filing date -
Jul 2, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an inter layer insulating film allows for inter layer connection between plural wiring films insulated from one another with plural inter layer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the inter layer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 .mu.m or smaller, and the multilayer wiring board itself for the electronic device has the flexibility.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully