Method for providing near-hermetically coated, thermally protected integrated circuit assemblies
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United States of America Patent
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May 1, 2012
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app pub date -
Apr 5, 2007
filing date -
Aug 23, 2006
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Abstract
The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes adding thermally conductive particles to a low processing temperature, at least near-hermetic, glass-based coating. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to at least one of the integrated circuit and the substrate. The method further includes curing the coating.
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