METHOD AND APPARATUS FOR DEBONDING OF STRUCTURES WHICH ARE BONDED TOGETHER, INCLUDING (BUT NOT LIMITED TO) DEBONDING OF SEMICONDUCTOR WAFERS FROM CARRIERS WHEN THE BONDING IS EFFECTED BY DOUBLE-SIDED ADHESIVE TAPE
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United States of America Patent
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N/A
Issued Date -
Dec 11, 2008
app pub date -
Jun 7, 2007
filing date -
Jun 7, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
When heat or UV radiation is applied to an adhesive tape (130) which bonds a semiconductor wafer (110) to a carrier (120), the appropriate lift-off time for separating the wafer from the carrier is determined by monitoring the thickness (T or .DELTA.T) of the wafer/tape/carrier sandwich. When the thickness or the thickness change has reached a predefined value or range of values, independently moveable driving members (510R) drive the wafer or the carrier with small forces at a plurality of spaced-apart locations along the periphery. As a result, the lift-off is initiated at the location of the weakest adhesion.
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