BONDING OF STRUCTURES TOGETHER INCLUDING, BUT NOT LIMITED TO, BONDING A SEMICONDUCTOR WAFER TO A CARRIER

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United States of America Patent

APP PUB NO 20080305580A1
SERIAL NO

11759652

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Abstract

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An expandable membrane (280), e.g. a membrane that is elastic and/or has a corrugated edge, is expanded to exert more uniform pressure over a semiconductor wafer (110) or a carrier (254) to bond the wafer to the carrier.

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Patent Owner(s)

Patent OwnerAddress
TRU-SI TECHNOLOGIES INC657 N PASTORIA AVENUE SUNNYVALE CA 94085

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Berger, Alexander J Palo Alto, CA 15 204
Savastiouk, Sergey San Jose, CA 36 2666

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