TRACE STRUCTURE AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Dec 18, 2008
app pub date -
Jun 12, 2007
filing date -
Jun 12, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A trace structure with a particular profile to eliminate stress concentration and the fabricating method thereof are provided. The trace structure includes a conductive line, a seed layer, and a protection layer, wherein an upper part of the trace line is covered by the protection layer to prevent sharp edges caused by over etching in the fabrication of the conductive line. Hence, the stress concentration due to the sharp edges in the trace structure is diminished and the reliability of packaging structures or other devices applying the trace structure is assured.
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