Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor
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United States of America Patent
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app pub date -
Jun 30, 2008
filing date -
May 7, 2002
priority date (Note) -
Abandoned
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Abstract
The present disclosure relates to a fingerprint sensor device. The device comprises a sensor having a sensitive active region that is electrically connected to a substrate. The device further includes a first resin bump positioned proximate to the sensitive active region. The first resin bump forms a finger guide that positions the finger over the sensitive active region when the finger slides in contact with the first resin bump.
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