Thick film circuit component and method for manufacturing the same
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United States of America Patent
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Issued Date -
Dec 18, 2008
app pub date -
Dec 18, 2006
filing date -
Dec 18, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A thick film circuit component has a thick film electrode interconnect which allows an electrode on a semiconductor chip and an aluminum wire to be directly bonded to each other with a sufficient bonding strength. The thick film circuit component has an insulated substrate 11 and a thick film electrode interconnect 12 disposed on the substrate. The thick film electrode interconnect 12 includes a bonding area for an aluminum wire, the bonding area comprising an Ag-Pt thick film 12a disposed as a lower layer and an Ag-Pd thick film 12b disposed as an upper layer. The bonding area comprises the Ag-Pt thick film 12a and the Ag-Pd thick film 12b, which are fused together.
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