Chip Card and Method For the Production of a Chip Card

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20080314990A1
SERIAL NO

12096006

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention pertains to a chip card and to a method for producing a chip card with a chip module that is contacted with an external contact arrangement arranged in the contact surface of a card body, as well as with an antenna device arranged in a card inlay, wherein the card inlay is initially produced in a first production device and the card inlay is subsequently provided with at least one respective external layer on both sides in a second production device, namely in such a way that the external contact arrangement arranged on the external contact side of the chip carrier is introduced into a recess of the assigned external layer, and wherein a connection between the card inlay and the external layers is subsequently produced in a laminating process.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SMARTRAC IP B VAMSTERDAM AMSTERDAM NORTH HOLLAND

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rietzler, Manfred Marktoberdorf, DE 88 1207

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