Packaged chip devices with atomic layer deposition protective films
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United States of America Patent
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May 10, 2011
Grant Date -
Dec 25, 2008
app pub date -
Jun 20, 2008
filing date -
Jun 20, 2007
priority date (Note) -
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Abstract
A low-temperature inorganic dielectric ALD film (e.g., Al.sub.2O.sub.3 and TiO.sub.2) is deposited on a packaged or unpackaged chip device so as to coat the device including any exposed electrical contacts. Such a low-temperature ALD film generally can be deposited without damaging the packaged chip device. The ALD film is typically deposited at a sufficient thickness to provide desired qualities (e.g., hermeticity for the entire packaged chip device, passivation for the electrical contacts, biocompatibility, etc.) but still allow for electrical connections to be made to the electrical contacts (e.g., by soldering or otherwise) directly through the ALD film without having to expose the electrical contacts.
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