INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM
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United States of America Patent
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app pub date -
Jun 25, 2007
filing date -
Jun 25, 2007
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Abandoned
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Abstract
An integrated circuit package-in-package system comprising: connecting a first integrated circuit device and a package substrate; applying a magnetic film over the first integrated circuit device; mounting a second integrated circuit device having an inner encapsulation over the magnetic film; and forming a package encapsulation over the first integrated circuit device, the magnetic film, and the second integrated circuit device.
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