SURFACE MOUNTING APPARATUS AND METHOD
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United States of America Patent
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N/A
Issued Date -
Jan 1, 2009
app pub date -
Dec 26, 2007
filing date -
Jun 29, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An exemplary method for surface mounting an electronic component onto a pad of a printed circuit board is provided. The electronic component and the printed circuit board are located onto a platform. An outline image of the electronic component is captured using a first image sensing device. Coordinates of a geometrical center of the electronic component are determined using a central processing device. An outline image of the pad is captured using a second image sensing device. Coordinates of a geometrical center of the pad are determined using the central processing device. The electronic component is moved onto the pad using a picking-up/placing device according to the coordinate of the geometrical center of the electronic component and the coordinate of the geometrical center of the pad. The electronic component can be registered with the pad exactly using the method.
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