INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING
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United States of America Patent
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app pub date -
Jun 29, 2007
filing date -
Jun 29, 2007
priority date (Note) -
Abandoned
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Abstract
An integrated circuit package system comprising: providing a substrate having a first substrate surface and a second substrate surface; forming a first package connector and a second package connector over substantially opposite locations of the first substrate surface and the second substrate surface; and attaching a first integrated circuit and a second integrated circuit adjacent the first package connector over the first substrate surface and the second package connector over the second substrate surface.
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