Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
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United States of America Patent
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Oct 5, 2010
Grant Date -
Jan 1, 2009
app pub date -
Jun 29, 2007
filing date -
Jun 29, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.
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