METHOD FOR PICKING UP A COMPONENT AS WELL AS A DEVICE SUITABLE FOR CARRYING OUT SUCH A METHOD
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United States of America Patent
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Issued Date -
Jan 8, 2009
app pub date -
Jul 2, 2008
filing date -
Jul 3, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for picking up a component from a film. The component is connected to the film by means of an adhesive bond, which adhesive bond between the component and the film is irradiated by means of an energy beam. Prior to the irradiation of the adhesive bond by means of the energy beam, a nozzle is placed into contact with the component on a side remote from the film by moving part of the film in the direction of the nozzle, after which the energy beam, which comprises a laser beam, is activated. The adhesive bond between the component and the film is at least substantially completely broken by the energy source. Following that, the component is picked up from the film by means of the nozzle.
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