Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
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United States of America Patent
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Dec 15, 2015
Grant Date -
Jan 8, 2009
app pub date -
Sep 19, 2008
filing date -
Dec 30, 2004
priority date (Note) -
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Abstract
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a method for manufacturing a microelectronic workpiece having a plurality of microelectronic dies. The individual dies include an integrated circuit and a terminal electrically coupled to the integrated circuit. In one embodiment, the method includes forming an opening in the workpiece in alignment with the terminal. The opening can be a through-hole extending through the workpiece or a blind hole that extends only partially through the substrate. The method continues by constructing an electrically conductive interconnect in the workpiece by depositing a solder material into at least a portion of the opening and in electrical contact with the terminal. In embodiments that include forming a blind hole, the workpiece can be thinned either before or after forming the hole.
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